Panacol Introduces New High-Performance Frame and Filling Adhesives
Panacol has developed a new high-performance adhesive series for frame and fill applications in printed circuit boards.
Frame and fill processes are used to protect highly complex areas on electronic circuit boards. In the first step, a highly viscous barrier called a frame is applied. In the next step, this area is quickly filled with low-viscosity fill material. Through this precise process, areas on the circuit board can be protected from mechanical impact factors. The combination of frame and fill materials allows for the application of minimum barrier and frame heights and curing to a homogeneous coating. Panacol's new frame and fill adhesives are perfectly matched, so that frame and fill areas can be best distributed wet-on-wet on the PCB without static liquid adhesives that would cause undesired flow.
The frame material, Structalit® 5704, is black, heat-curing and single-component epoxy. This frame and sphere top component exhibits excellent bead stability and high glass transition temperature between 150°C and 190°C, depending on curing parameters and layer thicknesses. When using Structalit® 5704, no bleeding effect occurs. Due to its very low ion content below 20 ppm, Structalit® 5704 is suitable for chip encapsulation in electronic circuit boards.
[caption id="attachment_123381" align="aligncenter"] Structalit® 5704 is applied as a stable "frame" and then filled with low-viscosity fill material to create a homogeneous protective coating from sensitive components.[/caption]As a fill material, Panacol has developed a series of adhesives with different rheological properties. The Structalit® 5717 - Structalit® 5721 adhesives are formulated with optimized flow behavior, so that the adhesives can be used in various die and wire bonding geometries due to differently adjusted viscosities. Since the fills have the same chemical base as the frame material, the fills also have excellent physical and chemical properties of high glass transition range, ion purity, temperature stability and minimal shrinkage behavior.
After curing, Structalit® 5704 and the matching fill of the Structalit® 5717-5721 series form a black, opaque and scratch-resistant coating. These properties, together with temperature resistance up to 200°C, provide maximum reliability.
