Panacol Launches Fast-Curing Epoxy Resin Adhesive

Fast-Curing Epoxy Resin Adhesive from Panacol Panacol, a leading international manufacturer of industrial and medical adhesives, has launched Structalit® 5604. Structalit® 5604 is an extremely fast-curing adhesive specially developed for bonding SMDs to printed circuit boards. The adhesive is epoxy resin-based and, despite its high viscosity, is suitable for jet application. Structalit® 5604 is a one-component epoxy resin adhesive that provides good contrast with green PCB material due to its red color. This makes visual in-process inspection possible. The one-component adhesive can be applied in production by spraying, valve dispensing or screen printing. Its ideally adjusted viscosity and high thixotropic index enable high-speed dispensing, precise dot profiles and wet tack without sagging prior to curing. Structalit® 5604 cures with heat. The thermal curing process takes place within minutes even at low temperatures. When fully cured, the adhesive is extremely temperature-resistant. It can withstand temperatures up to 270°C for short periods, which makes it suitable for reflow soldering processes. It is impact-resistant and bonds durably to FR4 printed circuit boards, metals and epoxy-based molded compounds. With a glass transition range above 115°C, the adhesive is ideal for electronic component assembly. It does not lose adhesiveness or soften at high temperatures. Since Structalit® 5604 has been developed specifically for use in electronics, it has high ionic purity and thus provides optimum protection against internal corrosion. Source