Panacol Launches New Dual-Cure Adhesives

New Dual-cure Adhesives from Panacol Panacol, a leading global manufacturer of industrial adhesives, continues to expand its portfolio of dual-cure acrylic adhesive systems with the launch of Vitralit® UD 8055 and Vitralit® UD 8056. These adhesives are primarily cured with UV light. The two adhesive systems have a high glass transition range above 100°C, which helps protect high-strength bonds from thermal cycle stress. Additionally, a secondary moisture-initiated cure mechanism is used to compensate for shaded areas. Vitralit® UD 8055 and Vitralit® UD 8056 are ideal for use as encapsulants providing environmental protection to sensors and PCB components. They can also be used for bonding different substrates, including many plastics and metals with undercuts or geometric voids. The advantage of dual cure is clearly evident in this case: the secondary moisture cure mechanism overcomes the difficulties created by shaded bond lines and ensures robust adhesion. In the primary UV cure process, bonded areas on the component are fixed with UV light within seconds. LED curing systems with wavelengths of 365 or 405nm can be used. LED systems provide the shortest cycle times as they require no heating phase. LED and UV pioneer Dr. Hönle offers a wide range of spot and flood-style systems that match optimally with Panacol's adhesives and can be individually adapted to application requirements. In the secondary cure process, uncrosslinked monomers in shaded areas are crosslinked with atmospheric moisture without requiring stress or secondary thermal effects. This technology enables fast cycle times and high-volume production without exposing temperature-sensitive electronic assemblies or components to excessive thermal stress. Vitralit® UD 8055 and Vitralit® UD 8056 provide high adhesion on typical surfaces such as FR4, PC and PBT. Vitralit® UD 8055 has demonstrated highly reliable adhesive performance in demanding 85/85 aging tests. Vitralit® UD 8056 demonstrates impressive performance, particularly on liquid crystal polymers (LCP), and has passed UL94 HB tests. With cure depths exceeding a few millimeters, these two low-halogen adhesives have many applications in electronic assembly. Source