Bostik Launches New Solvent-Free Adhesive

Bostik Launches New Solvent-Free Adhesive Bostik, a leading global adhesive manufacturer in the construction sector as well as industrial and consumer markets, has introduced HERBERTS LF686/H186, a high-performance solvent-free adhesive, to the Chinese market. Primarily used in composites of rigid and high-barrier materials such as PET/AL, PET/VMPET, AL/NY* and other composite structures, Bostik HERBERTS LF686/H186 can also be utilized in food, fast-moving consumer goods, pharmaceutical packaging, daily chemical products, personal care products and other applications. HERBERTS LF686/H186 features a wide range of applications and advanced levelling properties. It is suitable for various printing configurations in PET/AL and PET/VMPET composite structures. It offers good composite appearance and does not produce white spots when exiting the machine. This solvent-free adhesive is suitable for boil-in-bag packages with aluminium foil inner layers, retort pouches with aluminium foil construction and high-performance thermal-resistant aluminium foil pharmaceutical package moulds. Additionally, it features advanced chemical resistance, a broad range of product applications and stable bonding process characteristics. HERBERTS LF686/H186, containing no solvent residue, is an ideal solution for rigid composite structures. Source