Amkor to Build Advanced Packaging Facility in Arizona

Amkor Technology, Inc., a leading provider of semiconductor packaging and test services, announced plans to establish an advanced packaging and test facility in Peoria, Arizona. Upon completion of the project, Amkor plans to invest approximately USD 2 billion and employ approximately 2,000 people at the new facility, which will be the largest outsourced advanced packaging facility in the United States. Giel Rutten, President and Chief Executive Officer of Amkor, stated, "The expansion of the U.S. semiconductor supply chain continues, and as the largest U.S.-based advanced packaging company, we are excited to lead efforts to strengthen America's advanced packaging capacity. Semiconductor companies, foundries and other supply chain partners recognize the need to strategically expand their geographic footprint. The announcement of our new advanced packaging and test facility in Arizona is a clear sign of our commitment to help our customers provide flexible supply chains and be part of a strong American semiconductor ecosystem," he added. Amkor purchased approximately 55 acres of land with the goal of building a state-of-the-art manufacturing campus with more than 500,000 square meters of clean room space. The first phase of the facility is targeted to be ready for production within the next two to three years. Amkor plans to provide high-volume, cutting-edge technologies for advanced packaging and testing of semiconductors to support key markets such as high-performance computing, automotive and communications. Amkor worked in close collaboration with Apple on the strategic vision and core manufacturing capacity of the Peoria facility, which will package and test chips produced for Apple at the nearby TSMC fab. Apple was identified as the facility's first and largest customer. Source